Wafer Spin Photoresist Coater

Description

The automatic wafer photoresist coater is suitable for 8 "wafer bumping process, which is composed of wafer transfer, spin coating and baking area.
It can provide two kinds of processes for photoresists with different film thickness. The photoresist is supplied by a high pressure bottle or an accurate micro pump, and the output resistance is accurate to 0.1 CC.
It is equipped with the photoresist spray head and chamber moistening system to avoid the dust of photoresist and maintain the maximum cleanliness of the process.
The photoresist coater chamber has the following features, such as easy to remove, easy to clean and easy to install, which shorten preventive maintenance time, and reduce the burden of equipment engineers.
Each module can run independently and the main program flow and each station subroutine can be edited.
Graphical corresponding operation interface with simple operation and easy maintenance.
The machine is composed of two main body parts, one is the transmission and the photoresist coating module, and the other is the cold and hot baking tray module.

Robot arm automatically taking and releasing wafer, wafer seeking edge and centering, automatic photoresist coating and soft baking cooling.
The parameters of the photoresist coating program include the photoresist pipeline, spin speed, acceleration, corresponding time, EBR and Exhaust on/off.
Spin speed ranges from 50 to 5000 rpm, with the precision of +/-1 rpm.
High precision hot plate temperature control with temperature control range in 50 ~ 200 ° C, the average temperature uniformity can be up to 0.8 ° C. Cold plate temperature control ability is within 0.2 ° C.
The machine has the Class 100 HEPA. The chamber is designed without dust, photoresist back spatter, EBR and BSR back spatter.
The uniformity of photoresists with different thickness is within 5%.
Equipped with photoresist dummy dispense function