WPC-240
Semi-auto wafer cleaner
- Professional chip/camera module cleaning equipment
- Remove the dust particles on the wafers and the surface of CMOS
- Soft spray - high speed centrifugal dehydration
Specification
| Parameter | |
|---|---|
| Maximum working disk | Φ 310mm |
| Clean water supply pressure | >2.0Kgf |
| Maximum cleaning workpiece | Φ300MM/310mm |
| Cleaning water flow setting range | ＜4L/min |
| Cleaning way | Water and gas two fluid cleaning |
| DI supply cleanliness requirements | >16MΩ |
| drying way | High speed centrifugal dehydration (ion wind) |
| Clean compressed air supply pressure | 0.45—0.7mpa |
| Working disk rotation number range | 0--2800 r/min |
| Clean compressed air cleanliness requirements | Ultra-clean compressed air with filtration degree above 0.01um/99.5%, residual oil＜0.1ppm |
| Centrifugal cleaning release pressure | 1.5—13.8kg |
| Air supply and exhaust capacity | 3.0m3/min |
| Maximum consumption of clean compressed air | When cleaning:＜210L/MIN |
| Maximum consumption of clean DI water | When cleaning:＜3L/min |
| materials of equipment | Whole machine with 316 mirror stainless steel |
| control mode | PLC+ touchscreen |
| Minimum diameter of cleanable particle | ≧1um 99%以上 |
| power supply | 220V 5A 50/60HZ |
| Weight | About 160KG |
| Size | 600mm(L)×500mm(W)×1570mm(H) |
